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Date:	Fri, 19 Jul 2013 10:33:34 +1200
From:	Lilith Bryant <dark141 AT gmail DOT com>
Subject:	Re: [geda-user] PCB BGA (ball grid array) Package/Footprint
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	<CALSZ9goF9oRVUfHM_UDyM60Kr=x4ONsXVtnVe4VJdm=F9YmDBg AT mail DOT gmail DOT com> (from
	r DOT butts2 AT gmail DOT com on Fri Jul 19 01:19:25 2013)
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On 2013-07-19 01:19:25 AM, Rob Butts wrote:
> Has anyone done a PCB using the new chips with the BGA (ball grid array)?
> If so, how did you define the footprint?  As through-holes?  Fab shops must
> be capable of accommodating these ICs otherwise they wouldn't exist.
> 
> I'm thinking they must be easy to solder since it would simply fall into
> it's position with either pre-soldered holes or pre-soldered pins/balls.
> 

I have just finished a paying job using an iMX6 processor (624 ball 0.8mm), 
FPGA (256 ball 1mm), and 4xDDR3 (96 ball 0.8mm).    However, even for 
personal use prototypes, I wouldn't even try doing it myself.   It needs 
proper solder paste mask and a well controlled oven.   i.e. just pay a 
contract assembler to do it.   Even my hobby time isn't worth the hassle 
of bad BGA connections.

BTW, if you are thinking about generating a pick-and-place (xy) file for 
these,  PCB as it stands won't handle it.

However, if someone would be so kind as to commit the following patch it 
will:

https://bugs.launchpad.net/pcb/+bug/1095516

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