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Date:	Thu, 18 Jul 2013 14:29:55 -0400
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Subject:	Re: [geda-user] PCB BGA (ball grid array) Package/Footprint
From:	Rob Butts <r DOT butts2 AT gmail DOT com>
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I'm not sure exactly what you mean here,

I was thinking the pads would have a small detent the IC would settle into
but apparently no such luck.  It would just make it easier to line up.  The
people I have doing my assembly have a hard time as I imagine most people
do.

Thanks


On Thu, Jul 18, 2013 at 12:51 PM, Bob Paddock <graceindustries AT gmail DOT com>wrote:

> > The other is applying a thin layer of
> > flux to the area of the BGA footprint.
>
> Make sure there is a clear path for water flow (cleaning fluids) for
> ingress and egress of the flux.
>
> Makes a difference in reliability of high impedance circuits and ultra
> low power circuits.
>
> "Make it smaller" does not always go well with "make it manufacturable"
> when
>  hard to clean parts (BGA/QFN/LCC/LGA) are surrounded by things like
> bypass caps for example. :-(
>

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<div dir=3D"ltr"><div>I&#39;m not sure exactly what you mean here,</div><di=
v>=A0</div><div>I was thinking the pads would have a small detent the IC wo=
uld settle into but apparently no such luck.=A0 It would just make it easie=
r to line up.=A0 The people I have doing my assembly have a hard time as I =
imagine most people do.</div>
<div>=A0</div><div>Thanks</div></div><div class=3D"gmail_extra"><br><br><di=
v class=3D"gmail_quote">On Thu, Jul 18, 2013 at 12:51 PM, Bob Paddock <span=
 dir=3D"ltr">&lt;<a href=3D"mailto:graceindustries AT gmail DOT com" target=3D"_bl=
ank">graceindustries AT gmail DOT com</a>&gt;</span> wrote:<br>
<blockquote class=3D"gmail_quote" style=3D"margin:0 0 0 .8ex;border-left:1p=
x #ccc solid;padding-left:1ex"><div class=3D"im">&gt; The other is applying=
 a thin layer of<br>
&gt; flux to the area of the BGA footprint.<br>
<br>
</div>Make sure there is a clear path for water flow (cleaning fluids) for<=
br>
ingress and egress of the flux.<br>
<br>
Makes a difference in reliability of high impedance circuits and ultra<br>
low power circuits.<br>
<br>
&quot;Make it smaller&quot; does not always go well with &quot;make it manu=
facturable&quot; when<br>
=A0hard to clean parts (BGA/QFN/LCC/LGA) are surrounded by things like<br>
bypass caps for example. :-(<br>
</blockquote></div><br></div>

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