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Date:	Thu, 18 Jul 2013 12:51:12 -0400
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Subject:	Re: [geda-user] PCB BGA (ball grid array) Package/Footprint
From:	Bob Paddock <graceindustries AT gmail DOT com>
To:	geda-user AT delorie DOT com
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> The other is applying a thin layer of
> flux to the area of the BGA footprint.

Make sure there is a clear path for water flow (cleaning fluids) for
ingress and egress of the flux.

Makes a difference in reliability of high impedance circuits and ultra
low power circuits.

"Make it smaller" does not always go well with "make it manufacturable" when
 hard to clean parts (BGA/QFN/LCC/LGA) are surrounded by things like
bypass caps for example. :-(

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