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Mail Archives: geda-user/2012/06/28/03:39:15

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Message-ID: <4FEC09F7.8050904@gmail.com>
Date: Thu, 28 Jun 2012 09:38:31 +0200
From: 1tmt <onetmt AT gmail DOT com>
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To: <geda-user AT delorie DOT com>
Subject: Re: [geda-user] TPS40210 thermal pad
References: <20120528201658 DOT GB16992 AT malakian DOT lan>
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Reply-To: geda-user AT delorie DOT com

Andrew Poelstra ha scritto lo scorso 28/05/2012 22:16:
> 
> Hey all,
> 
> Does anyone have experience with the TPS40210 switching power
> supply? It is a fairly new chip from TI.
> 
> My question is: can I connect the thermal relief pad to GND?
> The datasheet says nothing about internal connections to the
> thermal pad.
> 

Hi,

not sure about 40210, but I've already used the TPS5450 (SO8+PowerPad)
and the TPS62172 (WSON8+PowerPad); in both cases I connected the PwPad
to ground (and to an "onsolder,nopaste" pad connected by vias to the
component-side PwPad for thermal dissipation and - mainly - for paste
draining).

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