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From:	"Rob Butts (r DOT butts DOT geda AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
Date:	Thu, 2 Jan 2020 18:02:46 -0500
Message-ID:	<CAM7eQ1kDNTFUVquYEUZDj0cOmHQFmMsOawFb_P_uBVTx_+sy3Q@mail.gmail.com>
Subject:	Re: [geda-user] Home soldering LGA-12 suggestions
To:	geda-user AT delorie DOT com
Reply-To:	geda-user AT delorie DOT com

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Thanks
I have to wait to try these

On Thu, Jan 2, 2020 at 5:21 PM Thomas D. Dean (tomdean AT wavecable DOT com) [via
geda-user AT delorie DOT com] <geda-user AT delorie DOT com> wrote:

> On 1/2/20 11:10 AM, N (nicklas DOT karlsson17 AT gmail DOT com) [via
> geda-user AT delorie DOT com] wrote:
> > You use solder flux?
> >
> >> I'm using a 2-axis gyro chip in a design and the largest package pith I
> can
> >> find is 0.5mm pitch.
> >>
> >> I have a solder paste dispenser along with a hot air setup.  The problem
> >> I'm having is that the solder dispenser puts out too much paste on the
> >> shortest time pulse setting.  My footprint has extended pads in the
> hope of
> >> solder prepping the pads, place the chip then going around the outer
> pads
> >> to reflow the solder (with the smallest soldering iron tip) but it is so
> >> small and the chip is just not sticking.
> >>
> >> Any suggestions?
> >
>
> http://www.seattlerobotics.org/presentations/2012-02-18-SMTsoldering.pdf
>
> Tom Dean
>

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<div dir=3D"ltr">Thanks<div>I have to wait to try these</div></div><br><div=
 class=3D"gmail_quote"><div dir=3D"ltr" class=3D"gmail_attr">On Thu, Jan 2,=
 2020 at 5:21 PM Thomas D. Dean (<a href=3D"mailto:tomdean AT wavecable DOT com">t=
omdean AT wavecable DOT com</a>) [via <a href=3D"mailto:geda-user AT delorie DOT com">ged=
a-user AT delorie DOT com</a>] &lt;<a href=3D"mailto:geda-user AT delorie DOT com">geda-u=
ser AT delorie DOT com</a>&gt; wrote:<br></div><blockquote class=3D"gmail_quote" s=
tyle=3D"margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);pad=
ding-left:1ex">On 1/2/20 11:10 AM, N (<a href=3D"mailto:nicklas.karlsson17@=
gmail.com" target=3D"_blank">nicklas DOT karlsson17 AT gmail DOT com</a>) [via <br>
<a href=3D"mailto:geda-user AT delorie DOT com" target=3D"_blank">geda-user AT delori=
e.com</a>] wrote:<br>
&gt; You use solder flux?<br>
&gt; <br>
&gt;&gt; I&#39;m using a 2-axis gyro chip in a design and the largest packa=
ge pith I can<br>
&gt;&gt; find is 0.5mm pitch.<br>
&gt;&gt;<br>
&gt;&gt; I have a solder paste dispenser along with a hot air setup.=C2=A0 =
The problem<br>
&gt;&gt; I&#39;m having is that the solder dispenser puts out too much past=
e on the<br>
&gt;&gt; shortest time pulse setting.=C2=A0 My footprint has extended pads =
in the hope of<br>
&gt;&gt; solder prepping the pads, place the chip then going around the out=
er pads<br>
&gt;&gt; to reflow the solder (with the smallest soldering iron tip) but it=
 is so<br>
&gt;&gt; small and the chip is just not sticking.<br>
&gt;&gt;<br>
&gt;&gt; Any suggestions?<br>
&gt; <br>
<br>
<a href=3D"http://www.seattlerobotics.org/presentations/2012-02-18-SMTsolde=
ring.pdf" rel=3D"noreferrer" target=3D"_blank">http://www.seattlerobotics.o=
rg/presentations/2012-02-18-SMTsoldering.pdf</a><br>
<br>
Tom Dean<br>
</blockquote></div>

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