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From: | DJ Delorie <dj AT delorie DOT com> |
To: | geda-user AT delorie DOT com |
Subject: | Re: [geda-user] Thermals: size problem, SMD |
In-Reply-To: | <9f527cf8-d7c0-2b6a-641f-23efb3663ff2@linetec.nl> (geda-user@delorie.com) |
Date: | Thu, 12 Jul 2018 16:36:25 -0400 |
Message-ID: | <xny3eg42eu.fsf@envy.delorie.com> |
MIME-Version: | 1.0 |
Reply-To: | geda-user AT delorie DOT com |
Errors-To: | nobody AT delorie DOT com |
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"Richard Rasker (rasker AT linetec DOT nl) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com> writes: > 1: When I create small vias with a thermal, e.g. 0.3 mm drill width, > 0.15 mm annulus width and 0.15 mm clearing, the resulting four thermal > connections to the surrounding copper plane get so narrow (just below > 0.125 mm), that my PCB manufacturer flags a warning. The Thermal[] entry in your *.pcb sets the thermal ratio; the default is 0.5. http://pcb.geda-project.org/pcb-4.1.2/pcb.html#Thermal-syntax > 2: SMD thermals, or the lack thereof. If I really need thermals, I > create tiny rectangles without clearance (S key) to connect pads to the > surrounding copper planes. Lack thereof. Technically possible, but difficult to guess what kinds of thermals work for the wide range of SMD pad shapes and groupings.
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