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Subject: | Re: [geda-user] Some MSL questions |
To: | geda-user AT delorie DOT com |
References: | <5bbf7252-eb65-59a3-71c5-90ee617f0650 AT linetec DOT nl> |
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From: | "Richard Rasker (rasker AT linetec DOT nl) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com> |
Message-ID: | <fc12af21-f8fa-b8c6-e051-fce9315a1cd4@linetec.nl> |
Date: | Thu, 12 Jul 2018 21:23:28 +0200 |
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Hello Bob, Op 11-07-18 om 15:26 schreef Bob Paddock (graceindustries AT gmail DOT com) [via geda-user AT delorie DOT com]: >> It appears that an increasing number of integrated circuits have >> Moisture Sensitivity Level 2 or higher. > J-STD-033B: > > "Standard for Handling, > Packing, Shipping and > Use of Moisture/Reflow > Sensitive Surface > Mount Devices" : > > http://www.navsea.navy.mil/Portals/103/Documents/NSWC_Crane/SD-18/Test%20Methods/jstd033.pdf > > Other 'It Depends' answers found here: > > http://www.circuitinsight.com/programs/54767.html > > http://www.circuitinsight.com/programs/53499.html > > http://www.circuitinsight.com/programs/51401.html OK, thanks. So basically it's best to just stick with the recommended procedures, and not to gamble with expensive prototype boards. Those few extra dollars in components don't weigh up to half a day's work (or more). I was also hoping for some experiences though, both good and bad -- has anyone here had a component failure that was caused by moisture absorption? Just curious... Best regards, Richard Rasker
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