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"Carlos Nieves (cnieves DOT mail AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com> writes: > Hi, > I think both options can be needed. The usual way would be option B. > > Option A can be used for other complex things... > > I remember seeing some special PCB supplier supports components inside > a cavity. I mean being able to place a smd component to be soldered at > layer 3, for example, in a PCB with more than 4 layers. There is a > hole or cavity in layers 1 and 2 to allow this. > > Of course this is not usual... But please design the core properly so > everything could be done at some point in the future... Also: Rigid-flex boards, with components on rigid outer layers, and on flex outer/inner layers. > Regards, > > Carlos > -- Stephan
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