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On Sun, 13 Aug 2017, Carlos Nieves wrote: >Hi, >I think both options can be needed. The usual way would be option B. > >Option A can be used for other complex things... > >I remember seeing some special PCB supplier supports components inside a >cavity. I mean being able to place a smd component to be soldered at layer >3, for example, in a PCB with more than 4 layers. There is a hole or cavity >in layers 1 and 2 to allow this. Nice! A similar random special case: As a hobbyst, when I do 2 layer and vias, I have to solder in a piece of wire (I don't want to keep chemicals for plating). I once considered drilling a large enough hole and put a 0603 in there and solder at both ends, sort of combining a via and a resistor. Then I realized pcb-rnd didn't support that at all. I think it'll be possible with pad stacks and subcircuits. > >Of course this is not usual... But please design the core properly so >everything could be done at some point in the future... Thanks, that's my intention! Regards, Igor2
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