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Date:	Tue, 6 Jun 2017 11:17:19 +0200 (CEST)
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To:	"Nicklas Karlsson (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
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Subject:	Re: [geda-user] [pcb] semi-bugreport: buffer layers, broken paste
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On Tue, 6 Jun 2017, Nicklas Karlsson (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com] wrote:

> The problem with disagreement between buffer and layout is ovbious.
> Where you really able to come with a solution for paste to work anyway?

Yup, I commited the fix in pcb-rnd yesterday. Tested on all corner cases I 
could come up with and it worked reasonably. No more layer mixup.

> Or you used similar approach as for footprints?

It's the same dynamic mapping I use for subcircuits.

(Old footprints happen to work only because it has a very limited concept 
of layers and an associated code that does the hardwired mapping. I don't 
change the footprint code as I will remove the old footprint code competly 
later this year.)

Regards,

Igor2

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