X-Authentication-Warning:	delorie.com: mail set sender to geda-user-bounces using -f
X-Recipient:	geda-user AT delorie DOT com
X-Original-DKIM-Signature:	v=1; a=rsa-sha256; c=relaxed/relaxed;
	d=gmail.com; s=20161025;
	h=date:from:to:subject:message-id:in-reply-to:references:mime-version
	:content-transfer-encoding;
	bh=jr0i540JKLEeXS4Apk3bclauhpuUGO6m2+YGHlrI+Zc=;
	b=X+U0y+0yhP/wVDWe/azi+DFLbKuBF674S/Uw0KmM5jSC41wkj9hjFlkiGdgrnBbMJp
	UiAn6MXzHqvI8VYP9GqG+gzD1fLHyFVWUAEg0bdz4xa407w6UMfyK/4Pb/m4BA6o+QIm
	du5dW+OwC2aajLb5j3990rpHMKMgUbQANfIybMdYP2GwzfpSgI9MIAp+bT5CLJwE1Q3b
	OwiXvx0qylkPkHU8zWbgC6gOTBJJ3RFg54V2WCBNZh2VGkgvWnmQ9Ouoh6fyOpw9GuVN
	kbYGCPcx3SfK+I6mETNU9+WS+qoXIPijhvDRkZMuDAI0QN4FYIJQe9YPg/bcMZSFXhNa
	PmOw==
X-Google-DKIM-Signature:	v=1; a=rsa-sha256; c=relaxed/relaxed;
	d=1e100.net; s=20161025;
	h=x-gm-message-state:date:from:to:subject:message-id:in-reply-to
	:references:mime-version:content-transfer-encoding;
	bh=jr0i540JKLEeXS4Apk3bclauhpuUGO6m2+YGHlrI+Zc=;
	b=g/1auDIJvxTDYDRMiFyaeHG5quhelDQVuo8vbwuffTllMaqNclf34IHm0bmcm9zZHQ
	Dt8wJwmCU3Fl+xCntxt4zYhnIIa/edvzN62yOvQuwZov2jdXR246k5PApzMypjgK34DR
	1F5r1nfLcsxHLWbmt31h1jzVyTk+RBG7sj7HxaPpIY/Vnz+or/OO/WDm0GdkDCOI2yTl
	txUcUok6ef6rmtvISZ9k5KOGUuYd/SwL10r2mKDNX0UsLL5iCTDj9Gqle7PCpcrplNSD
	0EjbunJ+ARN8C/t3cdc/+khJRPegRV6Xbo0uPZF/skx3iUfXUm44QCxrz5HoJbH5dqj5
	KGjA==
X-Gm-Message-State:	AFeK/H1fklOAjuCE84vjyhdIh2AB2WOdpWqBi7HvHVL+ByUCxycz5Z8H419hEOjNMShsiQ==
X-Received:	by 10.25.181.194 with SMTP id g63mr164858lfk.47.1490891218570;
	Thu, 30 Mar 2017 09:26:58 -0700 (PDT)
Date:	Thu, 30 Mar 2017 18:26:55 +0200
From:	"Nicklas Karlsson (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
To:	geda-user AT delorie DOT com
Subject:	Re: [geda-user] No support for solder paste in pcb file format ?
Message-Id:	<20170330182655.91a8f3e1f328bd0becb1ca3f@gmail.com>
In-Reply-To:	<CA+qhd=_y_waDfNMpmROtd7X6E1Rn-BYcYiD7SHkePNwhCKTXZg@mail.gmail.com>
References:	<20170327154129 DOT 68029809DB6C AT turkos DOT aspodata DOT se>
	<CA+qhd=_Gi=-wrWOKJSrVq3stF5uCLpfur8KcW3FnLrn7=vF+4w AT mail DOT gmail DOT com>
	<20170328132437 DOT 46A6B809DB6C AT turkos DOT aspodata DOT se>
	<CA+qhd=-tZ7cxoB4Db_Bkx47U15OoWUAkiHAW_Xo7aWX8GYfTRQ AT mail DOT gmail DOT com>
	<CAC4O8c_c76o0A7RFvZuKOnS9JidWR5fz+CVKYFBO307AA1PF8g AT mail DOT gmail DOT com>
	<CA+qhd=_5PGzXEr-KvKKCRZtgtd0oFvD-=6AjD=D=0_tf93VV+Q AT mail DOT gmail DOT com>
	<20170329182946 DOT ae2033e7ec476c9f1ddd35f3 AT gmail DOT com>
	<CA+qhd=_y_waDfNMpmROtd7X6E1Rn-BYcYiD7SHkePNwhCKTXZg AT mail DOT gmail DOT com>
X-Mailer:	Sylpheed 3.5.1 (GTK+ 2.24.31; x86_64-pc-linux-gnu)
Mime-Version:	1.0
Reply-To:	geda-user AT delorie DOT com
Errors-To:	nobody AT delorie DOT com
X-Mailing-List:	geda-user AT delorie DOT com
X-Unsubscribes-To:	listserv AT delorie DOT com

> > > > >> John Luciani:
> > > > >> > I create stencil footprints with the same basename as
> > > > >> > the component footprint and a ".sfp" extension. I have
> > > > >> > a script that parses the pcb and identifies all components
> > > > >> > that have a stencil footprint.
> > > >
> > > > I couldn't find this script on your page.  Could you please post or
> > link?
> > > >
> > >
> > > The script isn't quite ready for prime-time.
> >
> > But you tell why these scipts are good?
> >
> >
> The current script identifies the footprints that should be changed when
> generating gerbers for a stencil. The completed script will perform the
> replacement.

To put it another way. Is it better to generate paste layer from a script than manually editing each footprint?


> > > > >> as thin line silk for checking or write the pads to the sfp file.
> > > > >>
> > > > >> Do you have any specific file format for your sfp files ?
> > > > >>
> > > > >
> > > > > I just make them as normal footprints. For example - the stencil
> > > > footprint
> > > > > below is for a Cree XP-G LED --
> > > > >
> > > > > Element[0x0 "LED" "" "" 0 0 9996 2996 0 100 0x0]
> > > > > (
> > > > >    Pad[-5511 -5511 -5511 5511 1968 2000 2968 "" "1" 0x0100]
> > > > >    Pad[5511 -5511 5511 5511 1968 2000 2968 "" "2" 0x0100]
> > > > >    Pad[-492 -3937 492 -3937 2952 2000 3952 "" "3" 0x0100]
> > > > >    Pad[-492 0 492 0 2952 2000 3952 "" "3" 0x0100]
> > > > >    Pad[-492 3937 492 3937 2952 2000 3952 "" "3" 0x0100]
> > > > >    ElementLine[7996 -2484 7996 -7996 1000]
> > > > >    ElementLine[7996 -7996 -7996 -7996 1000]
> > > > >    ElementLine[-7996 -7996 -7996 -2484 1000]
> > > > >    ElementLine[7996 2484 7996 7996 1000]
> > > > >    ElementLine[7996 7996 -7996 7996 1000]
> > > > >    ElementLine[-7996 7996 -7996 2484 1000]
> > > > >    ElementArc[-7996 -10496 500 500 0 360 1000]
> > > > > )
> >
> > The *.sfp files are used to define shapes for solder paste?
> >
> 
> The shapes define openings in a stencil.

Then the shapes end up on the "stencil" layer, I think "paste" layer is a common name for this layer.


> > > For thermal pads I always use the grid. I have seen a lot of production
> > > problems. Bridging and misalignments. On these large pads I use a grid
> > > which reduces the coverage to between 50 - 60%.
> >
> > You use a grid because there will be production problems for a solid shape?
> >
> 
> Yes. I have seen bridging and misalignments. All of the components that
> I have used (with thermal pads) have recommended stencil openings
> as well as footprints. I either follow the datasheet recommendation or
> the manufacturer application notes.

I do not perfectly understand this, do you have an example for example datasheet or application note?


Regards Nicklas Karlsson

- Raw text -