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From: | "John Luciani (jluciani AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com> |
Date: | Wed, 29 Mar 2017 17:44:21 -0400 |
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Subject: | Re: [geda-user] No support for solder paste in pcb file format ? |
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--001a113ebfccb427a7054be57a31 Content-Type: text/plain; charset=UTF-8 On Wed, Mar 29, 2017 at 12:29 PM, Nicklas Karlsson ( nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com] < geda-user AT delorie DOT com> wrote: > > > >> John Luciani: > > > >> > I create stencil footprints with the same basename as > > > >> > the component footprint and a ".sfp" extension. I have > > > >> > a script that parses the pcb and identifies all components > > > >> > that have a stencil footprint. > > > > > > I couldn't find this script on your page. Could you please post or > link? > > > > > > > The script isn't quite ready for prime-time. > > But you tell why these scipts are good? > > The current script identifies the footprints that should be changed when generating gerbers for a stencil. The completed script will perform the replacement. > > > > >> Then I could have a flag in the fp generator to either make paste > pads > > > >> as thin line silk for checking or write the pads to the sfp file. > > > >> > > > >> Do you have any specific file format for your sfp files ? > > > >> > > > > > > > > I just make them as normal footprints. For example - the stencil > > > footprint > > > > below is for a Cree XP-G LED -- > > > > > > > > Element[0x0 "LED" "" "" 0 0 9996 2996 0 100 0x0] > > > > ( > > > > Pad[-5511 -5511 -5511 5511 1968 2000 2968 "" "1" 0x0100] > > > > Pad[5511 -5511 5511 5511 1968 2000 2968 "" "2" 0x0100] > > > > Pad[-492 -3937 492 -3937 2952 2000 3952 "" "3" 0x0100] > > > > Pad[-492 0 492 0 2952 2000 3952 "" "3" 0x0100] > > > > Pad[-492 3937 492 3937 2952 2000 3952 "" "3" 0x0100] > > > > ElementLine[7996 -2484 7996 -7996 1000] > > > > ElementLine[7996 -7996 -7996 -7996 1000] > > > > ElementLine[-7996 -7996 -7996 -2484 1000] > > > > ElementLine[7996 2484 7996 7996 1000] > > > > ElementLine[7996 7996 -7996 7996 1000] > > > > ElementLine[-7996 7996 -7996 2484 1000] > > > > ElementArc[-7996 -10496 500 500 0 360 1000] > > > > ) > > The *.sfp files are used to define shapes for solder paste? > The shapes define openings in a stencil. > > > > For thermal pads I always use the grid. I have seen a lot of production > > problems. Bridging and misalignments. On these large pads I use a grid > > which reduces the coverage to between 50 - 60%. > > You use a grid because there will be production problems for a solid shape? > Yes. I have seen bridging and misalignments. All of the components that I have used (with thermal pads) have recommended stencil openings as well as footprints. I either follow the datasheet recommendation or the manufacturer application notes. John L -- http://www.wiblocks.com --001a113ebfccb427a7054be57a31 Content-Type: text/html; charset=UTF-8 Content-Transfer-Encoding: quoted-printable <div dir=3D"ltr"><div class=3D"gmail_extra"><div class=3D"gmail_quote">On W= ed, Mar 29, 2017 at 12:29 PM, Nicklas Karlsson (<a href=3D"mailto:nicklas.k= arlsson17 AT gmail DOT com">nicklas DOT karlsson17 AT gmail DOT com</a>) [via <a href=3D"mail= to:geda-user AT delorie DOT com">geda-user AT delorie DOT com</a>] <span dir=3D"ltr"><= <a href=3D"mailto:geda-user AT delorie DOT com" target=3D"_blank">geda-user AT delori= e.com</a>></span> wrote:<br><blockquote class=3D"gmail_quote" style=3D"m= argin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);padding-left= :1ex"><span class=3D"gmail-">> > >> John Luciani:<br> > > >> > I create stencil footprints with the same basename = as<br> > > >> > the component footprint and a ".sfp" exte= nsion. I have<br> > > >> > a script that parses the pcb and identifies all com= ponents<br> > > >> > that have a stencil footprint.<br> > ><br> > > I couldn't find this script on your page.=C2=A0 Could you ple= ase post or link?<br> > ><br> ><br> > The script isn't quite ready for prime-time.<br> <br> </span>But you tell why these scipts are good?<br> <span class=3D"gmail-"><br></span></blockquote><div><br></div><div>The curr= ent script identifies the footprints that should be changed when<br></div><= div>generating gerbers for a stencil. The completed script will perform the= <br></div><div>replacement.<br></div><div><br>=C2=A0</div><blockquote class= =3D"gmail_quote" style=3D"margin:0px 0px 0px 0.8ex;border-left:1px solid rg= b(204,204,204);padding-left:1ex"><span class=3D"gmail-"> <br> > > >> Then I could have a flag in the fp generator to either m= ake paste pads<br> > > >> as thin line silk for checking or write the pads to the = sfp file.<br> > > >><br> > > >> Do you have any specific file format for your sfp files = ?<br> > > >><br> > > ><br> > > > I just make them as normal footprints. For example - the ste= ncil<br> > > footprint<br> > > > below is for a Cree XP-G LED --<br> > > ><br> > > > Element[0x0 "LED" "" "" 0 0 99= 96 2996 0 100 0x0]<br> > > > (<br> > > >=C2=A0 =C2=A0 Pad[-5511 -5511 -5511 5511 1968 2000 2968 "= ;" "1" 0x0100]<br> > > >=C2=A0 =C2=A0 Pad[5511 -5511 5511 5511 1968 2000 2968 "&= quot; "2" 0x0100]<br> > > >=C2=A0 =C2=A0 Pad[-492 -3937 492 -3937 2952 2000 3952 "&= quot; "3" 0x0100]<br> > > >=C2=A0 =C2=A0 Pad[-492 0 492 0 2952 2000 3952 "" &q= uot;3" 0x0100]<br> > > >=C2=A0 =C2=A0 Pad[-492 3937 492 3937 2952 2000 3952 "&qu= ot; "3" 0x0100]<br> > > >=C2=A0 =C2=A0 ElementLine[7996 -2484 7996 -7996 1000]<br> > > >=C2=A0 =C2=A0 ElementLine[7996 -7996 -7996 -7996 1000]<br> > > >=C2=A0 =C2=A0 ElementLine[-7996 -7996 -7996 -2484 1000]<br> > > >=C2=A0 =C2=A0 ElementLine[7996 2484 7996 7996 1000]<br> > > >=C2=A0 =C2=A0 ElementLine[7996 7996 -7996 7996 1000]<br> > > >=C2=A0 =C2=A0 ElementLine[-7996 7996 -7996 2484 1000]<br> > > >=C2=A0 =C2=A0 ElementArc[-7996 -10496 500 500 0 360 1000]<br> > > > )<br> <br> </span>The *.sfp files are used to define shapes for solder paste?<br></blo= ckquote><div><br></div><div>The shapes define openings in a stencil.<br></d= iv><div><br>=C2=A0</div><blockquote class=3D"gmail_quote" style=3D"margin:0= px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);padding-left:1ex"> <span class=3D"gmail-"><br> <br> > For thermal pads I always use the grid. I have seen a lot of productio= n<br> > problems. Bridging and misalignments. On these large pads I use a grid= <br> > which reduces the coverage to between 50 - 60%.<br> <br> </span>You use a grid because there will be production problems for a solid= shape?<br></blockquote><div><br></div><div>Yes. I have seen bridging and m= isalignments. All of the components that<br></div><div>I have used (with th= ermal pads) have recommended stencil openings<br></div><div>as well as foo= tprints. I either follow the datasheet recommendation or<br></div><div>the = manufacturer application notes.<br><br></div><div>John L<br></div><div><br>= </div><div><br><br>=C2=A0</div></div><br><br clear=3D"all"><br>-- <br><div = class=3D"gmail_signature"><a href=3D"http://www.wiblocks.com" target=3D"_bl= ank">http://www.wiblocks.com</a> =C2=A0</div> </div></div> --001a113ebfccb427a7054be57a31--
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