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Subject:	Re: [geda-user] QFN packages solder mask
To:	geda-user AT delorie DOT com
References:	<2df480cc-5ef2-9ac6-b7ad-d17788a6b8b9 AT ecosensory DOT com>
From:	"Dan McMahill (dan AT mcmahill DOT net) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
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Date:	Tue, 17 Jan 2017 23:00:39 -0500
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On 1/17/2017 4:47 PM, John Griessen (john AT ecosensory DOT com) [via 
geda-user AT delorie DOT com] wrote:
> I've been making footprints for QFN packages and came across guidelines
> by the chip makers that say
> it is beneficial to have some solder mask under the edge of the QFN
> package, but not if it gets too thin
> anywhere, as it can come off and cause trouble if it is.

I don't have great suggestions about the soldermask bit.  Did you look 
at the QFN footprints in the ~geda library?  I thought we had a decent 
coverage of packages but it has been a while since I looked.

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