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	Sat, 12 Nov 2016 09:00:18 -0800 (PST)
Subject:	Re: [geda-user] pcb file format
To:	geda-user AT delorie DOT com
References:	<0d49697a-80c7-d588-859a-56bc542f7e5d AT ecosensory DOT com>
From:	"Charles Repetti (charlie94965 AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
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Date:	Sat, 12 Nov 2016 09:00:15 -0800
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PCB Manual:

8.8.18 Pad
Pad [rX1 rY1 rX2 rY2 Thickness Clearance Mask "Name" "Number" SFlags]

So the solder mask (paste) layer is defined per pad as "Mask", and for 
me has been the most important parameter to get right. The different 
manufacturers have different capabilities, and their DFM tools can be 
used to highlight this.

The assembler may change this parameter to suit their needs no matter 
what the customer specifies. A high-powered microscope is helpful to 
check the fillets of the assembled boards to insure the manufacturer 
does this satisfactorily.


On 11/11/16 5:23 PM, John Griessen (john AT ecosensory DOT com) [via 
geda-user AT delorie DOT com] wrote:
> Can the paste layer be generated with different shrink amount per 
> footprint, or is it a per board thing?

- Raw text -