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DJ Delorie <dj AT delorie DOT com> writes: >> - Remove the assumption that all layers except "outline" are conductive. >> - Make implicit layers explicit and allow to draw on them, soldermask, solderpaste. > > I already did these two, although the GUIs need to catch up. However, > Peter has expressed interest in refactoring how it's done. I remember having read about that. The more reason to put it into the list, so we can show progess :-) I did not dare to do git pull for a while, until all flight boards are really done. Last week I had to revise a rigid-flex detector carrier in the last minute and order with 150% expedition fee. I am a bit nervous... ( The plan was to replace the flight caps 220nF 0805 with 10µF 0805 6.3V X7R caps from Digikey on the original board, to keep the ASIC from doing strange things at -40°C. Could you even buy those a few years ago? Now I made space for 10µF 1206 16V X7R caps. Still not the parts ESA wants us to fly, which are almost 1cm³, but not that close to the state of the art in ceramic caps. http://www.ieap.uni-kiel.de/et/people/stephan/solo/eda/idef-x/v05/idef-x.png ) -- Stephan
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