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Tue, 26 Jan 2016 10:30:04 -0800 (PST) | |
Date: | Tue, 26 Jan 2016 19:29:39 +0100 |
From: | "Nicklas Karlsson (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com> |
To: | geda-user AT delorie DOT com |
Subject: | Re: [geda-user] [pcb] poll: burried/blind vias vs. pcb and pcb-rnd |
(How ?) | |
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> If you can afford a custom ASIC, you can afford a top-end EDA package, > and a FAB that supports high-end features. Frankly, PCB is not a > high-end package and custom ASIC users are not our target audience. I do not consider buried/blind via a very high-end future. gschem attributes are not high-end yet very flexible. pcb have preconceptions about how a via/pin/pad look and allow only change of parameters. Nicklas Karlsson
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