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Date:	Sat, 24 Oct 2015 19:23:39 +0000
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Subject:	Re: [geda-user] The Chippocolypse is coming!
From:	"Evan Foss (evanfoss AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
To:	gEDA users mailing list <geda-user AT delorie DOT com>
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On Sat, Oct 24, 2015 at 3:40 PM, Larry Doolittle
<ldoolitt AT recycle DOT lbl DOT gov> wrote:
> Friends -
>
> On Sat, Oct 24, 2015 at 06:15:22AM +0000, Evan Foss (evanfoss AT gmail DOT com) [via geda-user AT delorie DOT com] wrote:
>> > Both the LTC6655 and LT6654 are available in SMD plastic and ceramic
>> > package, but I've only used the plastic ones. The ceramic package
>> > has stability advantages over long term and temperature cycling
>> > which are of no interest in my applications.
>> Thanks for this it actually is useful in something I am playing with now.
>
> I have also tested the LTC6655, and can confirm it's really good.

+1

> Better then competetive modern products I've found.  You do have
> to keep the package away from air currents.

That goes for anything like this. LT sells a lot of parts with plastic
covers over their metal can.

>   - Larry



-- 
Home
http://evanfoss.googlepages.com/
Work
http://forge.abcd.harvard.edu/gf/project/epl_engineering/wiki/

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