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Date:	Sat, 14 Feb 2015 18:53:28 -0500
Message-ID:	<CAM2RGhT1tjdghX5EU0WL94CbjTHN_D3r9jrUVnSsn7pYW4bNrw@mail.gmail.com>
Subject:	Re: [geda-user] FOSDEM
From:	Evan Foss <evanfoss AT gmail DOT com>
To:	geda-user AT delorie DOT com
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I would want full 3D data since you can always reject data but adding
it in later is hard. just look at how long this thread has gotten.

A simple hight does not help me when I have parts like this
http://www.mouser.com/ProductDetail/Omron/2SMPP-02/?qs=3P%252bcriiv584EfFf%252bLos22A%3D%3D&kpid=492727993&gclid=CjwKEAiAgfymBRCEhpTR8NXpx1USJAAV0dQylSBgkXS3S-jSknPvwRo1CnbsiYWkc30-ns0GFfAO2xoC7Nbw_wcB

(pressure sensor with vertical port for a hose)


On Sat, Feb 14, 2015 at 6:36 PM, Peter Clifton <pcjc2 AT cam DOT ac DOT uk> wrote:
> On Sat, 2015-02-14 at 21:38 +0100, Kai-Martin Knaak wrote:
>> Lev wrote:
>>
>> > * arbitrary paste shape
>> > * arbitrary solder mask openings
>>
>> even more important: blind and buried vias. These are essential to deal
>> with FPGAs.
>>
>>
>> > * 3D data - at least a height would be nice
>>
>> 3D can be and should be delegated to specialized applications.
>
> Respectfully, I believe you are wrong on this point. I'll invite you to
> watch my FOSDEM talk on the subject once the videos are online.
>
> Peter
>
> --
> Peter Clifton <peter DOT clifton AT clifton-electronics DOT co DOT uk>
>
> Clifton Electronics
>



-- 
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http://forge.abcd.harvard.edu/gf/project/epl_engineering/wiki/

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