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On Sat, 2015-02-14 at 21:38 +0100, Kai-Martin Knaak wrote: > Lev wrote: > > > * arbitrary paste shape > > * arbitrary solder mask openings > > even more important: blind and buried vias. These are essential to deal > with FPGAs. > > > > * 3D data - at least a height would be nice > > 3D can be and should be delegated to specialized applications. Respectfully, I believe you are wrong on this point. I'll invite you to watch my FOSDEM talk on the subject once the videos are online. Peter -- Peter Clifton <peter DOT clifton AT clifton-electronics DOT co DOT uk> Clifton Electronics
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