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Date: | Tue, 3 Feb 2015 21:47:17 -0500 |
Message-Id: | <201502040247.t142lHOM017606@envy.delorie.com> |
From: | DJ Delorie <dj AT delorie DOT com> |
To: | geda-user AT delorie DOT com |
In-reply-to: | <mas0aa$ngv$1@ger.gmane.org> (message from Kai-Martin Knaak on |
Wed, 04 Feb 2015 03:38:58 +0100) | |
Subject: | Re: [geda-user] Footprint Generator |
References: | <C00DE067-87C2-4F44-B225-2EF53B4C22D9 AT sbcglobal DOT net> <mamudg$ou4$1 AT ger DOT gmane DOT org> <1345A71A-1F70-4FCD-B738-883EA3C833E5 AT sbcglobal DOT net> <marhgq$kkl$1 AT ger DOT gmane DOT org> <CAOFvGD7VKhSTFEHHpSTUr4yLzP95=y8nTsx_y7WBnyjfZOXyKA AT mail DOT gmail DOT com> <mas0aa$ngv$1 AT ger DOT gmane DOT org> |
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> A "footprint" or an "element" are not quite the same as in common > languages. footprint - the impression of something on a surface element - a component of a whole In PCB, the footprint is the pattern, where the element has all the additional information that makes it a unique portion of the whole design. You could argue that we use different terms than other EDA packages, but that only means we're different (or they're different), not wrong. > The notion of "solder side", "solder layer" and "component side" > coexists with "top side" and "bottom side". We're working on that one, we've been migrating to just top/bottom. This, however, is a case where everyone *did* use the same terms (component/solder) but had to diverge when SMT and multi-layer boards became the norm.
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