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Date:	Mon, 02 Feb 2015 11:45:57 +0100
From:	Bernhard Kraft <kraftb AT think-open DOT at>
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 Content preview:  Hi, On 2015-01-31 20:01, mskala AT ansuz DOT sooke DOT bc DOT ca wrote: >
    The same problem exists - but is probably worse - when part of the copper
    > pour is connected to the rest only through a very narrow gap, such as >
    between two DIP pads. [...] 
 
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Subject: Re: [geda-user] Re: Ground Plane Behavior?
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Hi,

On 2015-01-31 20:01, mskala AT ansuz DOT sooke DOT bc DOT ca wrote:

> The same problem exists - but is probably worse - when part of the copper
> pour is connected to the rest only through a very narrow gap, such as
> between two DIP pads.

For this one there is an issue on launchpad:
https://bugs.launchpad.net/pcb/+bug/699335


If there is no issue/report about the problem I experience I will go and 
file a report. I just wanted to ask beforehand as I did not do a very 
in-depth study of the issues on launchpad.


greetings,
Bernhard
-- 
Wer nicht gelegentlich auch einmal kausalwidrige Dinge zu denken vermag,
wird seine Wissenschaft nie um eine neue Idee bereichern können.
Max Planck (1858-1947)

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