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	27 Feb 2014 20:33:47 -0800 (PST)
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Date:	Fri, 28 Feb 2014 11:33:47 +0700
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Subject:	Re: [geda-user] Via under a pad?
From:	Eugene Mikhantiev <mikhantiev AT gmail DOT com>
To:	geda-user AT delorie DOT com
Reply-To:	geda-user AT delorie DOT com
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2014-02-28 3:15 GMT+07:00 Stuart Brorson <sdb AT cloud9 DOT net>:
> Yes, it's generally bad practice because the vias will suck solder
> down into the hole and away from the pad during reflow.  This will
> leave the part with little or no solder holding it to the board.
>

Yes, but there are several techniques used in the PCB manufacture
process, which can solve this problem. For example, VIA-IN-PAD, when
holes are filled with a special compound. Sometimes, especially when
using BGA, this is the only possible solution.
But not all PCB manufacturers can do it.

-- 
With best regards,
Eugene Mikhantiev

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