delorie.com/archives/browse.cgi | search |
X-Authentication-Warning: | delorie.com: mail set sender to geda-user-bounces using -f |
X-Recipient: | geda-user AT delorie DOT com |
DKIM-Signature: | v=1; a=rsa-sha256; c=relaxed/relaxed; |
d=gmail.com; s=20120113; | |
h=mime-version:in-reply-to:references:date:message-id:subject:from:to | |
:content-type; | |
bh=ynIxv3B1YXFUJ0E/t05bCP3WN4Upk+yH60MQV9FwaKU=; | |
b=DAn38fcbduD8MALZp5s91o38vME+8oH8F/nmBqtXYKe0SJFgqv58Zkn6kT7CPwJ7y6 | |
iYLE2H3ZZaqj2qlO/IryGZ9OfL90Wih+1GNg4p05Xc4/dG0zfJELhCgphlKmoTVQHHSD | |
phKeRnBfvR+TEvMGK5M5WnEiEY8Wy2TTjTHUbbAhbGUNqEyMhkT4LC+RjhhU4miAPaNI | |
Mygqp6c5tCb+hVDldFbKsNjN5/mAfL2jeR3zU80JJNHCgutRAYPad8w4n6T1BvbOq9Cg | |
DGCKx5OMPE2IRFqrJreMVrjVkxUxgdAAakWBzeVRHVdhUrTg6Fqq6UAIr/7nXhEt3P6h | |
Rlcg== | |
MIME-Version: | 1.0 |
X-Received: | by 10.68.129.40 with SMTP id nt8mr14736673pbb.108.1381023803989; |
Sat, 05 Oct 2013 18:43:23 -0700 (PDT) | |
In-Reply-To: | <524FB65F.9050604@gmail.com> |
References: | <CAM2RGhTKEi4GFb3_sYV8FJRfqr0GTzWfpk28vQ-bDLoQpjvXyQ AT mail DOT gmail DOT com> |
<524FB65F DOT 9050604 AT gmail DOT com> | |
Date: | Sat, 5 Oct 2013 21:43:23 -0400 |
Message-ID: | <CAM2RGhSqy81ZMCjomOkbVCiX9nczAmiVwnhL_DYrBoCYDnqeyw@mail.gmail.com> |
Subject: | Re: [geda-user] polygons, arcs and footprints |
From: | Evan Foss <evanfoss AT gmail DOT com> |
To: | geda-user AT delorie DOT com |
Reply-To: | geda-user AT delorie DOT com |
Errors-To: | nobody AT delorie DOT com |
X-Mailing-List: | geda-user AT delorie DOT com |
X-Unsubscribes-To: | listserv AT delorie DOT com |
The microphone is an ADMP441. They use a ring round the input port to seal between the audio input of the microphone and the PCB. On Sat, Oct 5, 2013 at 2:49 AM, onetmt <onetmt AT gmail DOT com> wrote: > Il 04/10/2013 23:56, Evan Foss ha scritto: >> Hi folks, >> >> I am trying to make a footprint for an LTC3441. The bottom pad is a >> polygon. I know they are not possible in PCB footprints but does >> anyone have a good way to emulation one? > > For other components - for instance the BSC159 mosfet by Infineon - I > used several square pads partially overlapped, in order to get the right > "polygonal" pad. But in your case, imho, you should use a "normal" > footprint and then design the polygons on layer, placing vias also on > central powerpad as indicated in datasheet. > >> >> Also I am trying to use a MEMS microphone that uses a ring to seal it >> to the PCB. Again I know that does not exist but is there a way around >> it? > > It's difficult to say without knowing the component, but you can obtain > a ring - well, a sort of - by using appropriate clearance around an > "octagon" pad and placing a rectangle, maybe on a ground layer, around it. > >> >> -Evan >> > > > -- > Hofstadter's Law: > "It always takes longer than you expect, even when you take into account > Hofstadter's Law." -- Home http://evanfoss.googlepages.com/ Work http://forge.abcd.harvard.edu/gf/project/epl_engineering/wiki/
webmaster | delorie software privacy |
Copyright © 2019 by DJ Delorie | Updated Jul 2019 |