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	Mon, 26 Aug 2013 11:04:04 -0700 (PDT)
Date:	Mon, 26 Aug 2013 10:04:04 -0800
Message-ID:	<CAC4O8c9Zzc4OGqGn-zc0T-KdYkXch+fwQjyuuEF=P_ZQtjLmnw@mail.gmail.com>
Subject:	[geda-user] keeping solder mask off thermal rectangles?
From:	Britton Kerin <britton DOT kerin AT gmail DOT com>
To:	geda-user AT delorie DOT com
Reply-To:	geda-user AT delorie DOT com

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I've got a part with a thermal pad on the bottom of a SOIC package.

I was able to create rectangles on the solder and component sides of the
board, then connect them with vias, and turn the vias into thermals with
complete connections using thermal tool and shift-click.

The last thing I think I want to do is keep the solder mask off the
rectangular areas.  I think.  Or perhaps it doesn't really matter for heat
dissipation?

Anyway I haven't been able to sort out how to do this last thing.
Suggestions?

Thanks,
Britton

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<div dir=3D"ltr"><br>I&#39;ve got a part with a thermal pad on the bottom o=
f a SOIC package.<br><br>I was able to create rectangles on the solder and =
component sides of the board, then connect them with vias, and turn the via=
s into thermals with complete connections using thermal tool and shift-clic=
k.<br>
<br>The last thing I think I want to do is keep the solder mask off the rec=
tangular areas.=A0 I think.=A0 Or perhaps it doesn&#39;t really matter for =
heat dissipation?<br><br>Anyway I haven&#39;t been able to sort out how to =
do this last thing.=A0 Suggestions?<br>
<br>Thanks,<br>Britton<br><br></div>

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