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Date:	Fri, 15 Feb 2013 09:41:36 -0800
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Subject:	Re: [geda-user] Stencil opening in pcb footprint
From:	Russell Dill <Russ DOT Dill AT asu DOT edu>
To:	geda-user AT delorie DOT com
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On Fri, Feb 15, 2013 at 6:23 AM, onetmt <onetmt AT gmail DOT com> wrote:
>
> A lot of "modern" ICs, mainly those featuring a thermal/power pad,
> require stencil openings with different sizes from their respective to
> pad sizes; until now I managed stencil openings by manually editing the
> gerber layer generated by pcb, but this solution looks quite impractical
> when facing some complex boards with several of this ICs on them.
>
> Is there a way to define the stencil in footprint file, just like we do
> for mask opening?

Yes, use the nopaste flag for the pad itself, and then overlay it with
one or more smaller pads without the nopaste flag

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