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X-Recipient: | geda-user AT delorie DOT com |
Message-ID: | <4FEC09F7.8050904@gmail.com> |
Date: | Thu, 28 Jun 2012 09:38:31 +0200 |
From: | 1tmt <onetmt AT gmail DOT com> |
User-Agent: | Mozilla/5.0 (X11; Linux x86_64; rv:10.0.3) Gecko/20120324 Icedove/10.0.3 |
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To: | <geda-user AT delorie DOT com> |
Subject: | Re: [geda-user] TPS40210 thermal pad |
References: | <20120528201658 DOT GB16992 AT malakian DOT lan> |
In-Reply-To: | <20120528201658.GB16992@malakian.lan> |
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Reply-To: | geda-user AT delorie DOT com |
Andrew Poelstra ha scritto lo scorso 28/05/2012 22:16: > > Hey all, > > Does anyone have experience with the TPS40210 switching power > supply? It is a fairly new chip from TI. > > My question is: can I connect the thermal relief pad to GND? > The datasheet says nothing about internal connections to the > thermal pad. > Hi, not sure about 40210, but I've already used the TPS5450 (SO8+PowerPad) and the TPS62172 (WSON8+PowerPad); in both cases I connected the PwPad to ground (and to an "onsolder,nopaste" pad connected by vias to the component-side PwPad for thermal dissipation and - mainly - for paste draining).
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