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From:	"Cam (camfarnell AT bitflipper DOT ca) [via geda-help AT delorie DOT com]" <geda-help AT delorie DOT com>
Subject:	[geda-help] Four layer board
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Date:	Thu, 2 Apr 2020 18:26:43 -0300
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I'm using PCB 4.0.2. The board is too complex and tight to route with two layers. My next thought is to use four layers with the inner layers being devoted to power and ground with almost the entire layer copper and using thermals where it connects to pins and a gap for non-power pins. But I could see no way to achieve this with PCB. Am I missing something or is that just not supported?

I could simply do thick routes for power and ground on the interior layers but then there is the question of how to get power and ground to SMT components which exist only on the component layer. Hand placed vias near where power/ground pins are on the SMT devices?

Any advice appreciated.

Cam Farnell

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