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Message-ID:	<60890376.8030107@xs4all.nl>
Date:	Wed, 28 Apr 2021 08:40:54 +0200
From:	"Bert Timmerman (bert DOT timmerman AT xs4all DOT nl) [via geda-help AT delorie DOT com]" <geda-help AT delorie DOT com>
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To:	geda-help AT delorie DOT com
Subject:	Re: [geda-help] via in pad needs tenting...how?
References:	<5CCF512C-E056-45DF-9C88-944406D6FBDD AT ece DOT orst DOT edu>
In-Reply-To:	<5CCF512C-E056-45DF-9C88-944406D6FBDD@ece.orst.edu>
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Reply-To:	geda-help AT delorie DOT com

Roger Traylor (traylor AT engr DOT orst DOT edu) [via geda-help AT delorie DOT com] wrote:
> Folks,
> I have an RF part that needs five vias inside its bottom pad.  I’ve inserted the vias
> but the were not tented to my surprise.  Is there a way to tent vias that are inside
> a footprint's center pad?
> Thanks in advance,
> Roger Traylor
>    
Hi Roger,

I assume you want a tented via in an exposed pad to prevent solder from 
wicking in the via ?

That would be a difficult feat to achieve in current pcb.

I have never tried this and I would not know if any fab houses are able 
to deliver on that request.

Maybe pcb-rnd can help you.

Good luck and kind regards,

Bert Timmerman.

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