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Date:	Fri, 9 Dec 2016 17:09:45 +0100 (CET)
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Subject:	Re: [geda-help] Pins and vias: different clearance per layer
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On Fri, 9 Dec 2016, Carlos Moreno wrote:

> Hi,
>
> Essentially, what I'm trying to do is connect a pin or via
> to a plane (e.g., ground plane) without thermal release
> (i.e., solid connection).
>
> If I only have ground plane and no other layer has copper
> filling, then I simply set the clearance = 0 for the via.
> However, if I have one ground plane and one Vcc plane
> (or copper filling in the signal layer(s)), then the trick
> doesn't work.
>
> Can I accomplish this?   Maybe instead of playing with
> the clearance there may be a style for thermal that
> makes a solid connection (or at least control over the
> amount of thermal release, etc.)

Yes, there's a thermal style with solid conn. Press shift + click the 
thermal tool on the via/pin to cycle.

>
> Any tips?  (a solution involving manually editing the
> text file is perfectly fine)

Manual edit: add thermal(0S) in the flags (last "" field); the digit is 
the layer number.

HTH,

Igor2

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