X-Authentication-Warning:	delorie.com: mail set sender to geda-help-bounces using -f
X-Recipient:	geda-help AT delorie DOT com
X-Original-DKIM-Signature:	v=1; a=rsa-sha256; c=relaxed/relaxed;
	d=gmail.com; s=20120113;
	h=mime-version:in-reply-to:references:from:date:message-id:subject:to;
	bh=M5383dDqFr5udUjsJyWZuDs+pvG95SjCErOcd5fyfUM=;
	b=IyPmxB7xKeEFV95LmGl6BSHutqM4hHakLS3EcsQOU148mWLOY3rVPoLuiiJnmqfdo9
	La1b1OVVOwWN93tYGn/6DZNj/mkgSJdC/yKnK7oZKhutEFdBKap4GIsnmi1HcPW9W1GT
	42MlX9mlu7c8pUfD6eV/omxh6sTLzHrDMM9i6/RIEFw/dwW724f1aSykTWQQJiMZWRX+
	aoGpkp+v6InUXRuCQEWH2ANLzLLoFKEf2OqtB86ddFQZT7f9+tsYZhFR4IMs7w/VtsC0
	giYCFkpEXADKE/wEZoqvuDIS7w6NtbAeZZUfnzNh4Y1K2EF9dFalHQG54TX/NAWCxRNs
	4swA==
X-Google-DKIM-Signature:	v=1; a=rsa-sha256; c=relaxed/relaxed;
	d=1e100.net; s=20130820;
	h=x-gm-message-state:mime-version:in-reply-to:references:from:date
	:message-id:subject:to;
	bh=M5383dDqFr5udUjsJyWZuDs+pvG95SjCErOcd5fyfUM=;
	b=WoWCa81NVDhPL9zW/dvdkC2ZOA6EP2octKhixZ5wjyyYlybAPt/Ovkks7PmVwJ+6qT
	DwSpZ7wsCHUv/JnFyw9EWO5V7KB71IGpKdtlZe3R2KRipOevLb5+GVuFZfEZmcN4gOCU
	TSv7ULNWyBvgl6E9lkcUcDGV2R5FwUzavbhEqq3uuFKcqrrXuyQYv15OEhw0GzsjqunX
	vu6TjdUPn18r1dfZf2NaAV9pzUe5gXiu3piBLknikiEuAiH9dYLnQmyag2eT2t4GFBbP
	UPNmmFq4r63IV0KqCFYsEdVAObtUnl7krzMG5Gjs/AnGpoVFCW9j8qSxSwA+0z3eTjCx
	G9WA==
X-Gm-Message-State:	AE9vXwM5SsHSlfGrcM/eDwkoDGmkDYj/iBkMFJiv+ySdFvDlBPpG9/sS3P8jBzYxM6nX3YQsD9XEk6/ucM0+JA==
X-Received:	by 10.25.16.92 with SMTP id f89mr792766lfi.143.1472048603471; Wed,
	24 Aug 2016 07:23:23 -0700 (PDT)
MIME-Version:	1.0
In-Reply-To:	<39718d63-9fb1-3cd0-bcfd-32c60e0255ef@prochac.sk>
References:	<20160728160657 DOT 7f68f787 AT debian> <20160728174027 DOT 453b2b41 AT debian DOT olsr>
	<20160728192015 DOT 4fc84ce8 AT debian DOT olsr> <201607282248 DOT u6SMmTxw006065 AT envy DOT delorie DOT com>
	<f3e69165-857d-c541-33d1-557fc93172a4 AT prochac DOT sk> <b7127584-363e-2903-3382-8ba0eda2c02d AT prochac DOT sk>
	<39718d63-9fb1-3cd0-bcfd-32c60e0255ef AT prochac DOT sk>
From:	"Evan Foss (evanfoss AT gmail DOT com) [via geda-help AT delorie DOT com]" <geda-help AT delorie DOT com>
Date:	Wed, 24 Aug 2016 14:23:22 +0000
Message-ID:	<CAM2RGhRNs3Vw5rW2NTo_0ycgSatXiMGCjLKL1eWtYpnfg0enMw@mail.gmail.com>
Subject:	Re: [geda-help] pcb: blind via
To:	geda-help AT delorie DOT com
Reply-To:	geda-help AT delorie DOT com
Errors-To:	nobody AT delorie DOT com
X-Mailing-List:	geda-help AT delorie DOT com
X-Unsubscribes-To:	listserv AT delorie DOT com

On Wed, Aug 24, 2016 at 12:26 PM, Milan Prochac (milan AT prochac DOT sk)
[via geda-help AT delorie DOT com] <geda-help AT delorie DOT com> wrote:
>
> Status update, to keep the topic warm:
>
> * visual presentation:
>   - blind/buried vias have 2 half-circles drawn on top; colors indicate
> starting and ending layer of blind/buried via
> (https://static.bastl.sk/pcb/bvias_01.png)
>   - if all layers penetrated by blind/buried via are turned off the via is
> thin-drawn (https://static.bastl.sk/pcb/bvias_02.png)
>
> * action to set blind/buried vias was modified to allow set only one end and
> use currently active layer; such actions can be bound to menu items and
> hot-keys (done for GTK HID) - https://static.bastl.sk/pcb/bvias_03.png and
> https://static.bastl.sk/pcb/bvias_04.png. These actions together with
> visualisation and immediate on-screen changes seems to be sufficient user
> interface, so no GUI dialog will be implemented.
>
> * Ratnest optimization and short detection was modified to take blind/buried
> into account
>
> * Layer management is partially done - adding and removing layer works fine,
> moving layer is not completely finished/tested.
>
> * When layer is changed during line draw, the automatically created vias can
> be blind/buried; the same applies for line move from one layer to another.
> This behavior is controlled by option
> (https://static.bastl.sk/pcb/bvias_06.png). On following pictures the
> identical operation was first performed with option switched off (upper
> track) and with option switched on; line draw:
> https://static.bastl.sk/pcb/bvias_04.png and line move:
> https://static.bastl.sk/pcb/bvias_05.png. The via creation logic was not
> changed, only via type is affected.
>
> * export hid was adjusted to create additional drill layers for layer pairs
> connected by blind/buried vias. The default drill layer is used for
> through-hole pins and vias - if no blind/buried vias are used, there is no
> change in generated output.
>   - no changes in exporter API; backward compatibility with external
> exporters is retained
>   - PS and Gerber exporters were modified to accept additional layers - the
> only change was the filename creation (plus font size and line spacing on
> TOC page of PS export); for gerber the alternate naming schemes need to be
> adjusted.
>   - remaining standard exporters need to be reviewed, but at first look they
> do not need any change; the OpenSCAD exporter will be adjusted later.
>
> There are still some minor issues - for example freedom in layer grouping:
> if layer group does not contain contiguous layers, the behavior is confusing
> (but correct) in some situations. I need to decide the level of warnings
> about this situation or enforcing the contiguous layer groups.
>
> Another one are degraded vias (single layer vias). Vias with both ends on
> the same layer can be avoided (and automatically deleted after layer removal
> for example), but vias with both ends on same layer group cannot be avoided
> easily. Behavior is correct, just unnecessary copper ring with no associated
> drill is created on respective layer group.  Maybe these degraded vias
> should be detected as part of DRC.
>
> The special topic is the output used for PCB fabrication. Currently the
> drill pairs are automatically generated. Maybe  some kind of drill pair
> configuration and checks if design fits these pairs should be implemented. I
> have very little experience with commercial packages (and no time to learn
> them), so some feedback or ideas are welcome.

I like your ideas. I feel like we should have an easier way to make
vias though. Going to a drop down to select via and then what type is
more clicks. i think a separate button for non-through board via would
be a better option.

> Milan
>
>
>
>
> On 8/3/2016 3:31 AM, Milan Prochac (milan AT prochac DOT sk) [via
> geda-help AT delorie DOT com] wrote:
>>
>>
>> Update:
>>
>> Already implemented:
>>   1. internal representation. Single connection per via is implemented.
>> Via stacking will be enabled later.
>>   2. file format with backward compatibility (if no blind/buried vias are
>> used); bugs fixed
>>   3. new action SetViaLayers implemented. Select action extended by
>> BuriedVias parameter. See generated pcb.pdf for more details
>>       3a. Undo was extended to cover new operations
>>   4. object report (Ctrl-R) contains information about blind/buried vias
>>   5. Drawing code updated:
>>       5a. on GUI HID (screen) vias themselves are drawn unchanged. Any
>> recommendation how to visually distinguish blind/buriad vias from
>> through-hole vias are welcome.
>>       5b. on GUI HID (screen) clerarances and thermals are cut-out only on
>> respective layers
>>       5c. on non-GUI HID exporters both vias and clearances/thermals are
>> drawn on respective layers only
>>   6. exporters which use standard drawing interface displays correct data
>> (tested on PostScript and gerber). Drill information will require serious
>> reworking - single plated and unplated drill is not sufficient;
>>
>> What will come next
>>   7. ERC check (optimize rats) to evaluate connections only on proper
>> layers
>>   8. maintain layer information after layer operations: new layer, remove
>> layer, move layer
>>   9. maintain layer information after line move to another layer
>> 10. automatically create blind/buried via when changed layer during line
>> drawing; it will be controlled by option.
>> 11. update solder mask drawing
>> 12. GUI dialog to change via type
>>
>> Current code: https://static.bastl.sk/pcb/Burried-vias-step-2.tar.gz .
>> Testers are welcome.
>>
>> Milan
>>
>>
>
>



-- 
Home
http://evanfoss.googlepages.com/
Work
http://forge.abcd.harvard.edu/gf/project/epl_engineering/wiki/

-----BEGIN PGP PUBLIC KEY BLOCK-----
Version: GnuPG v2
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=Ta4p
-----END PGP PUBLIC KEY BLOCK-----

- Raw text -