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Oh Gott, Thanks for your work. You save my fingernails. Am Wed, 3 Aug 2016 03:31:40 +0200 schrieb "Milan Prochac (milan AT prochac DOT sk) [via geda-help AT delorie DOT com]" <geda-help AT delorie DOT com>: > Update: > > Already implemented: > 1. internal representation. Single connection per via is > implemented. Via stacking will be enabled later. > 2. file format with backward compatibility (if no blind/buried > vias are used); bugs fixed > 3. new action SetViaLayers implemented. Select action extended by > BuriedVias parameter. See generated pcb.pdf for more details > 3a. Undo was extended to cover new operations > 4. object report (Ctrl-R) contains information about blind/buried > vias 5. Drawing code updated: > 5a. on GUI HID (screen) vias themselves are drawn unchanged. > Any recommendation how to visually distinguish blind/buriad vias from > through-hole vias are welcome. > 5b. on GUI HID (screen) clerarances and thermals are cut-out > only on respective layers > 5c. on non-GUI HID exporters both vias and clearances/thermals > are drawn on respective layers only > 6. exporters which use standard drawing interface displays correct > data (tested on PostScript and gerber). Drill information will > require serious reworking - single plated and unplated drill is not > sufficient; > > What will come next > 7. ERC check (optimize rats) to evaluate connections only on > proper layers > 8. maintain layer information after layer operations: new layer, > remove layer, move layer > 9. maintain layer information after line move to another layer > 10. automatically create blind/buried via when changed layer during > line drawing; it will be controlled by option. > 11. update solder mask drawing > 12. GUI dialog to change via type > > Current code: > https://static.bastl.sk/pcb/Burried-vias-step-2.tar.gz . Testers are > welcome. > > Milan > >
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