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X-Recipient: | geda-help AT delorie DOT com |
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To: | geda-help AT delorie DOT com |
From: | "Ian Chapman (ichapman AT videotron DOT ca) [via geda-help AT delorie DOT com]" <geda-help AT delorie DOT com> |
Subject: | [geda-help] Thermal pad |
Message-id: | <564F4722.5080406@videotron.ca> |
Date: | Fri, 20 Nov 2015 11:15:30 -0500 |
User-Agent: | Mozilla/5.0 (X11; Linux x86_64; rv:38.0) Gecko/20100101 |
Thunderbird/38.3.0 | |
Reply-To: | geda-help AT delorie DOT com |
Hi all, Before I run into any unnecessary difficulties in layout I'd better ask the experts. It's a DDA package, an SO8 with a thermal pad. It was simple to add a pin 9 as a square pad inside the pins. My question is what is the best way to add half a dozen vias to the pad that connect electrically and thermally to the ground plane below? Regards Ian.
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