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Mail Archives: geda-help/2014/08/16/16:57:08

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Sat, 16 Aug 2014 13:56:25 -0700 (PDT)
Date: Sat, 16 Aug 2014 16:56:25 -0400
Message-ID: <CAAhxy3DyESymfA64xKNhsH9rrqJhjZH7H6zYeCDW-jGczHjBMg@mail.gmail.com>
Subject: [geda-help] irregular pads, hidden dangers
From: vattan <vatan DOT uml AT gmail DOT com>
To: "geda-help AT delorie DOT com" <geda-help AT delorie DOT com>
Reply-To: geda-help AT delorie DOT com

I often worry about how a creative solution may break something behind
the scenes in software.  Today I am worrying over odd pad shapes, and
if getting creative will just get me in trouble.
If you take a look at the datasheet for LM2596 and flip to page 39 you
will see a suggested pattern for the thermal pad behind it, where it
is a kind of T shape. I could make that with two boxes edge to edge,
or with overlap.  I am scared however of how this may be handeld in
the background and if it may cause wierd isolation patterns or
somthing subtle that i will not notice but a production house may
choke on.  From my limited expereince with code,  I know that zero
thickness areas can be subtly tricky from a code point of view, so
that scares me the most.   overlap is probably well handled, but I
don't know if it will throw up an error anywhere else.

currently my part is deisgned w/ a simple square pad, but I am curiuos
what the community/devs think of my concerns.  I am doing a little
brute force testing, but I am new  to board desig nso I don't really
know all the ways these things can go wrong.

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