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Sat, 16 Aug 2014 13:56:25 -0700 (PDT) | |
Date: | Sat, 16 Aug 2014 16:56:25 -0400 |
Message-ID: | <CAAhxy3DyESymfA64xKNhsH9rrqJhjZH7H6zYeCDW-jGczHjBMg@mail.gmail.com> |
Subject: | [geda-help] irregular pads, hidden dangers |
From: | vattan <vatan DOT uml AT gmail DOT com> |
To: | "geda-help AT delorie DOT com" <geda-help AT delorie DOT com> |
Reply-To: | geda-help AT delorie DOT com |
I often worry about how a creative solution may break something behind the scenes in software. Today I am worrying over odd pad shapes, and if getting creative will just get me in trouble. If you take a look at the datasheet for LM2596 and flip to page 39 you will see a suggested pattern for the thermal pad behind it, where it is a kind of T shape. I could make that with two boxes edge to edge, or with overlap. I am scared however of how this may be handeld in the background and if it may cause wierd isolation patterns or somthing subtle that i will not notice but a production house may choke on. From my limited expereince with code, I know that zero thickness areas can be subtly tricky from a code point of view, so that scares me the most. overlap is probably well handled, but I don't know if it will throw up an error anywhere else. currently my part is deisgned w/ a simple square pad, but I am curiuos what the community/devs think of my concerns. I am doing a little brute force testing, but I am new to board desig nso I don't really know all the ways these things can go wrong.
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