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Date:	Wed, 18 Jun 2014 14:36:37 -0400
Message-Id:	<201406181836.s5IIabnH001842@envy.delorie.com>
From:	DJ Delorie <dj AT delorie DOT com>
To:	geda-help AT delorie DOT com
In-reply-to:	<53A1964B.802@jollyrogerlabs.com> (message from Brian Davis on
	Wed, 18 Jun 2014 09:38:19 -0400)
Subject:	Re: [geda-help] Single side only pads
References:	<53A1964B DOT 802 AT jollyrogerlabs DOT com>
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Errors-To:	nobody AT delorie DOT com
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> I have a board for which most components and traces are on the solder 
> side, but a few need to have pads on the component side, so I would like 
> the ability to have pads only on a single side.  I ran across a 
> discussion from 2005 which suggested the use of very small annular rings 
> plus a coincident SMD pad, is this still the preferred method?  Is there 
> a way to embed this approach in a footprint, or do I need to perform 
> these actions for each board?

PCB uses "pads" to mean SMT component lands, is this what you mean?
Or do you mean the copper annulus around a pin?

The only way to have a pin with different annulus sizes on each side
is to have the "pin" have the smaller size, and use an overlapping SMT
pad for the larger size.  This can be done in the footprint.

But... if you're using both sides of the board, is there really a
reason to need to reduce the size of the annulus on the "unused" side?

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