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Date: Fri, 27 Apr 2012 10:52:36 +0200
From: Oliver Schinagl <oliver+list AT schinagl DOT nl>
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To: geda-user AT delorie DOT com
CC: Kai-Martin Knaak <kmk AT familieknaak DOT de>
Subject: Re: [geda-user] Re: Dual SPI Flash adapter attempt 2.0
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On 04/27/12 01:20, Kai-Martin Knaak wrote:
> Oliver Schinagl wrote:
>
>> Somehow I managed to mirror one of my labels on a component. So the
>> part was on the top side, while the label looked like it was on the
>> bottom side. Long story short, i just deleted the part, and copied it
>> from the neighboring part. Due to all the renaming though, I get all
>> strange connects when using the automated rats nest, but I guess
>> that's the price to pay.
>
> I prefer to drive my layout with gschem. That is, all parts in the
> layout are also mentiond in the schematic - no manual insertion of
> footprints in pcb. For a multiple instances like in your layout can
> be achieved with a hierarchical schematic.
I've had this as well initially, but labels where being messed up, so I 
just had to rename parts to be identical.

As for the copying the part, I just couldn't figure out (in 15 minutes) 
how or why the name of my footprint was mirrored.

Other then that, I completely agree.
>
>
>> So the big question is; shall I send this to seeed for fabrication
>
> The outline lines should look more simple. The gerbers expicitely
> call for a milled edge at the middle of each line. So ther should
> be a single line where you expect the fab to cut the board.
>
I'm not expecting the fab to cut the board, i'll probably do it manually 
here at home.

> The fabs I know, would object against such a multiple part layout
> and charge extra for their increased handling effort. They prefer
> layouts in one piece.
You are allowed to have 5 designs with Seeed on one PCB. I know this is 
strictly spoken 8, but I hope we can work out some sort of deal or cheat 
it through ;) It's for charity after all.
>
> Copper lines look a bit on the skinny side. If they are more beefy
> the manufactured board can be tweaked more easily. Depending on
> the currents, ground and supply may benefit from increased line
> thickness. If S1 and S2 are SMD supposed to be jumpers, then it
> may be hard to close them with a solder iron. The pads should be
> much wider than the gab to make the solder bridge more likely. 		
>
This bit, I don't understand. I choose the smallest part available, so 
that a solderbridge is very easy to make. (0201) I think the pads are 
about twice as big as the gap?

> ---<)kaimartin(>---