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Date: Tue, 30 May 2017 16:08:09 +0200 (CEST)
From: Roland Lutz <rlutz AT hedmen DOT org>
To: geda-user AT delorie DOT com
Subject: Re: [geda-user] [pcb-rnd] up next: subcircuits (a.k.a. footprint
 model redesign)
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On Tue, 30 May 2017, gedau AT igor2 DOT repo DOT hu wrote:
> 3rd: pad stacks and blind/buried vias (with the lowest score possible - 
> seems to be a lower priority task with no real user demand, postponed 
> for a later date)

I'm not actively doing PCB layout right now and haven't ever used blind or 
buried vias, so maybe my opinion shouldn't be weighed to heavily here, 
however: both "professional" electronic engineers I talked to which were 
considering switching to PCB for layout told me that the inability to use 
blind and buried vias was the mayor show stopper for them.