X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20120113; h=mime-version:in-reply-to:references:date:message-id:subject:from:to :content-type; bh=9fko65Ch+9jrQA5gSDTzACI+D20IbodLdDwomOQ0EUI=; b=HzunIBbMBMth0uhypiW9+VTELAMYFKhlytlJx9ijQdcjaGNh5z3rf+BXgQByDnnkqP DlYAHZfnbyVECzBjiuFLqgvFYyyBVYBfjyM+FWxiIvbnKWhMhyTMtGZtImk7nOk0VQCA GBFzXpKdt7WPbfDHDPHh8oqH3jhFw8RMfoVPLkCPGOkvXDLOO52FsP03fvl0PAHWTpsi VkndrdspnJWZMFkBEXK14mAeWl1AZvMTvXe5eHWkDdBkLqGJ8zmztmhYMmwceJGKDfxX doQ81SvgAUQABq6VUfBpX6AbFMYC09GnFXQb8ttV+xyHLMIXF+Yj9B9CDe6fUJpsGwuY Q8Ww== MIME-Version: 1.0 X-Received: by 10.180.126.9 with SMTP id mu9mr9975292wib.16.1377581085640; Mon, 26 Aug 2013 22:24:45 -0700 (PDT) In-Reply-To: References: Date: Mon, 26 Aug 2013 21:24:45 -0800 Message-ID: Subject: Re: [geda-user] keeping solder mask off thermal rectangles? From: Britton Kerin To: geda-user AT delorie DOT com Content-Type: multipart/alternative; boundary=e89a8f839d29424e1604e4e7179c Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk --e89a8f839d29424e1604e4e7179c Content-Type: text/plain; charset=ISO-8859-1 On Mon, Aug 26, 2013 at 12:33 PM, Russell Dill wrote: > On Mon, Aug 26, 2013 at 11:04 AM, Britton Kerin > wrote: > > > > I've got a part with a thermal pad on the bottom of a SOIC package. > > > > I was able to create rectangles on the solder and component sides of the > > board, then connect them with vias, and turn the vias into thermals with > > complete connections using thermal tool and shift-click. > > Pretty sure you want to *not* use thermals in this case, just a solid > connection. > You are right. I used the wrong term here, probably because pcb itself sort of does: to make a good thermal connection between top and bottom rectangles, you make a via, then turn it into a "thermal" with the thermal tool, then shift-click repeatedly to modify the thermal style to make it a solid connection, which isn't really a thermal in the normally understood sense, if I understand correctly. This is a case where pcb is sort of hiding some desirable functionality, I think. Britton --e89a8f839d29424e1604e4e7179c Content-Type: text/html; charset=ISO-8859-1 Content-Transfer-Encoding: quoted-printable



On Mon, Aug 26, 2013 at 12:33 PM, Russell Dill &l= t;Russ DOT Dill AT asu DOT edu<= /a>> wrote:
On Mon, Aug 26, 2013 at 11= :04 AM, Britton Kerin <britto= n DOT kerin AT gmail DOT com> wrote:
>
> I've got a part with a thermal pad on the bottom of a SOIC package= .
>
> I was able to create rectangles on the solder and component sides of t= he
> board, then connect them with vias, and turn the vias into thermals wi= th
> complete connections using thermal tool and shift-click.

Pretty sure you want to *not* use thermals in this case, just a solid=
connection.

You are right.=A0 I used the wrong ter= m here, probably because pcb itself sort
of does: to make a good thermal= connection between top and bottom rectangles,
you make a via, then turn= it into a "thermal" with the thermal tool, then shift-click
repeatedly to modify the thermal style to make it a solid connection, which= isn't
really a thermal in the normally understood sense, if I under= stand correctly.

This is a case where pcb is sort of hiding some des= irable functionality, I think.

Britton
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