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Subject:	Re: [geda-user] Home soldering LGA-12 suggestions
To:	geda-user AT delorie DOT com
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	<20200102201054 DOT f43d1cba4af49e5830a8d4dd AT gmail DOT com>
From:	"Thomas D. Dean (tomdean AT wavecable DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
Message-ID:	<d13e7831-fdbd-eb86-5ef7-f63001d92982@wavecable.com>
Date:	Thu, 2 Jan 2020 13:44:18 -0800
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On 1/2/20 11:10 AM, N (nicklas DOT karlsson17 AT gmail DOT com) [via 
geda-user AT delorie DOT com] wrote:
> You use solder flux?
> 
>> I'm using a 2-axis gyro chip in a design and the largest package pith I can
>> find is 0.5mm pitch.
>>
>> I have a solder paste dispenser along with a hot air setup.  The problem
>> I'm having is that the solder dispenser puts out too much paste on the
>> shortest time pulse setting.  My footprint has extended pads in the hope of
>> solder prepping the pads, place the chip then going around the outer pads
>> to reflow the solder (with the smallest soldering iron tip) but it is so
>> small and the chip is just not sticking.
>>
>> Any suggestions?
> 

http://www.seattlerobotics.org/presentations/2012-02-18-SMTsoldering.pdf

Tom Dean

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