delorie.com/archives/browse.cgi   search  
Mail Archives: geda-user/2020/01/02/14:59:17

X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f
X-Recipient: geda-user AT delorie DOT com
X-Original-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=earthlink.net;
s=dk12062016; t=1577993872; bh=vPu2vOZS1fEk8e/7zPgoJMxNcW0PumGphpVT
m+ifM9k=; h=Received:Subject:To:References:From:Organization:
Message-ID:Date:User-Agent:MIME-Version:In-Reply-To:Content-Type:
Content-Language:Content-Transfer-Encoding:X-ELNK-Trace:
X-Originating-IP; b=Bdi5dYgsJUy5HJEWWEVon1MQl5n5zNRVvC49Ewzdxf9iTg
q6gOobeyHEUiETDDm5gGVUhVeXb4nlpopLhSW5iTyO/mzRwa3o7y/edDJ5EflyE02Ul
ZAb/p4HTu+xLySU+y9Gy4MaVyOXB2LyQWfoe1Tgnr20xyKK1KznbebSa9b1bUarXpCw
GPyCL+fKMwXUFI5rjWWIdoBNkjQUgKqSFJgEK4TKjaLs4QARqfW5pFQAFkQY8qXEK90
3dVRYxVM6I/6PMdSBGFlbdCD+yc0Xah5spgmZ+oibld5Rhf6pB8Zw7uEjcWW+yYVyek
gQ8yUvMmp2fZaZxKTpSW/kQ6vzoA==
DomainKey-Signature: a=rsa-sha1; q=dns; c=nofws;
s=dk12062016; d=earthlink.net;
b=M/brjqnhHF6LgIWqEtd264N0YzzvgG+lzqg1ZRfPMRlbL2sCwM4wDhSj+fl2fbPwAC2+1KHXr6xAUDQ73d8J+uTDP5V7lGQ4ft5rF6H/K+BHr6lyEzpriL90rLAyLtNOeqrnvobxk8OOOm9Z+0E+A0ZYYuinRmdkWvd4pcEanZPQ1DH3Qt7AMTtvaA1rHeKu9xZ8L37g0BU/JecrQQbwkC9e2cwavRXPQ3NSpZkk6d0krrXpt0PbJG00HHAiMuQ6jD9u8jMTik7sjUBy3o16oOR8q1QHvMW+8qoHlNuahVinCc4hn3Lr4S5ubIfgJ89kOn0QHwr4IXJc7Q52VyMGnA==;
h=Received:Subject:To:References:From:Organization:Message-ID:Date:User-Agent:MIME-Version:In-Reply-To:Content-Type:Content-Language:Content-Transfer-Encoding:X-ELNK-Trace:X-Originating-IP;
Subject: Re: [geda-user] Home soldering LGA-12 suggestions
To: geda-user AT delorie DOT com
References: <CAM7eQ1n51EYFBiRTcTMDKvx19REkJiFb_Jr00LkbAkfGq6BqfA AT mail DOT gmail DOT com>
From: "David W. Schultz (david DOT schultz AT earthlink DOT net) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
Organization: State of Total Disorganization
Message-ID: <c01b6c7c-5f68-03bf-7fc9-ab9e38138574@earthlink.net>
Date: Thu, 2 Jan 2020 13:37:27 -0600
User-Agent: Mozilla/5.0 (X11; Linux x86_64; rv:68.0) Gecko/20100101
Thunderbird/68.2.2
MIME-Version: 1.0
In-Reply-To: <CAM7eQ1n51EYFBiRTcTMDKvx19REkJiFb_Jr00LkbAkfGq6BqfA@mail.gmail.com>
X-ELNK-Trace: a4aefb9622f3b04c5fcedd19d8a1076574bf435c0eb9d4780cd88000fac6a7c94a827677db8953fa57a9c90ffc79cd88350badd9bab72f9c350badd9bab72f9c
X-Originating-IP: 108.194.109.191
Reply-To: geda-user AT delorie DOT com
Errors-To: nobody AT delorie DOT com
X-Mailing-List: geda-user AT delorie DOT com
X-Unsubscribes-To: listserv AT delorie DOT com

On 1/2/20 12:02 PM, Rob Butts (r DOT butts DOT geda AT gmail DOT com) [via
geda-user AT delorie DOT com] wrote:
> I'm using a 2-axis gyro chip in a design and the largest package pith I
> can find is 0.5mm pitch.
> 
> I have a solder paste dispenser along with a hot air setup.  The problem
> I'm having is that the solder dispenser puts out too much paste on the
> shortest time pulse setting.  My footprint has extended pads in the hope
> of solder prepping the pads, place the chip then going around the
> outer pads to reflow the solder (with the smallest soldering iron tip)
> but it is so small and the chip is just not sticking.
> 
> Any suggestions?

I have tried a stencil with this sort of thing with mixed results. The
biggest problem I have is placing the part since it is impossible to
line up the part and pads. I have taken to adding alignment marks to the
silk layer to aid in placement.

-- 
https://web.archive.org/web/20190214181851/http://home.earthlink.net/~david.schultz/
(Web pages available only at the Wayback Machine because Earthlink
 terminated that service.)

- Raw text -


  webmaster     delorie software   privacy  
  Copyright © 2019   by DJ Delorie     Updated Jul 2019