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	Thu, 02 Jan 2020 11:10:57 -0800 (PST)
Date:	Thu, 2 Jan 2020 20:10:54 +0100
From:	"N (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
To:	geda-user AT delorie DOT com
Subject:	Re: [geda-user] Home soldering LGA-12 suggestions
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You use solder flux?

> I'm using a 2-axis gyro chip in a design and the largest package pith I can
> find is 0.5mm pitch.
> 
> I have a solder paste dispenser along with a hot air setup.  The problem
> I'm having is that the solder dispenser puts out too much paste on the
> shortest time pulse setting.  My footprint has extended pads in the hope of
> solder prepping the pads, place the chip then going around the outer pads
> to reflow the solder (with the smallest soldering iron tip) but it is so
> small and the chip is just not sticking.
> 
> Any suggestions?

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