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	Thu, 02 Jan 2020 11:09:18 -0800 (PST)
Date:	Thu, 2 Jan 2020 20:09:15 +0100
From:	"N (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
To:	geda-user AT delorie DOT com
Subject:	Re: [geda-user] Home soldering LGA-12 suggestions
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I used low temperature solder Sn42 Bi58 then soldering a few small packages by hand. Maybe it does not make a big different but it work.

Usually I chose simple to solder chips unless there is a good reason to chose others, availability is usually the reason I have to use harder to solder components. Read something about check quality of these packages with pads underneath is no easy task even for these with professional equipment but are no sure. I would however expect a slightly less problem and hence slightly lower price as well some less quality problems if chips are simple to solder but probably no big difference though my experience i very limited.


> I'm using a 2-axis gyro chip in a design and the largest package pith I can
> find is 0.5mm pitch.
> 
> I have a solder paste dispenser along with a hot air setup.  The problem
> I'm having is that the solder dispenser puts out too much paste on the
> shortest time pulse setting.  My footprint has extended pads in the hope of
> solder prepping the pads, place the chip then going around the outer pads
> to reflow the solder (with the smallest soldering iron tip) but it is so
> small and the chip is just not sticking.
> 
> Any suggestions?

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