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From:	"Majenko Technologies (matt AT majenko DOT co DOT uk) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
Date:	Thu, 2 Jan 2020 18:57:39 +0000
Message-ID:	<CAPp8_Do8bT5LDSidFz04e80PEQrKYPP5rUQW54c9WRNhLwO+bw@mail.gmail.com>
Subject:	Re: [geda-user] Home soldering LGA-12 suggestions
To:	"Vladimir Zhbanov (vzhbanov AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
Reply-To:	geda-user AT delorie DOT com

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Pre-solder the pads to give a nice smooth pillow on each one.  Add lots of
flux. Put the chip on. Use your hot-air to reflow the solder. Press down on
the chip (not with your finger, of course) and let it cool. Use your
soldering iron and more flux to remove excess solder that oozed out of the
side. Then reflow again with your hot air to ensure the chip is straight.

On Thu, Jan 2, 2020 at 6:54 PM Rob Butts (r DOT butts DOT geda AT gmail DOT com) [via
geda-user AT delorie DOT com] <geda-user AT delorie DOT com> wrote:

> I'm using a 2-axis gyro chip in a design and the largest package pith I
> can find is 0.5mm pitch.
>
> I have a solder paste dispenser along with a hot air setup.  The problem
> I'm having is that the solder dispenser puts out too much paste on the
> shortest time pulse setting.  My footprint has extended pads in the hope of
> solder prepping the pads, place the chip then going around the outer pads
> to reflow the solder (with the smallest soldering iron tip) but it is so
> small and the chip is just not sticking.
>
> Any suggestions?
>


-- 
*Matt Jenkins*
Majenko Technologies

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<div dir=3D"ltr">Pre-solder the pads to give a nice smooth pillow on each o=
ne.=C2=A0 Add lots of flux. Put the chip on. Use your hot-air to reflow the=
 solder. Press down on the chip (not with your finger, of course) and let i=
t cool. Use your soldering iron and more flux to remove excess solder that =
oozed out of the side. Then reflow again with your hot air to ensure the ch=
ip is straight.</div><br><div class=3D"gmail_quote"><div dir=3D"ltr" class=
=3D"gmail_attr">On Thu, Jan 2, 2020 at 6:54 PM Rob Butts (<a href=3D"mailto=
:r DOT butts DOT geda AT gmail DOT com">r DOT butts DOT geda AT gmail DOT com</a>) [via <a href=3D"mailto=
:geda-user AT delorie DOT com">geda-user AT delorie DOT com</a>] &lt;<a href=3D"mailto:ge=
da-user AT delorie DOT com">geda-user AT delorie DOT com</a>&gt; wrote:<br></div><blockqu=
ote class=3D"gmail_quote" style=3D"margin:0px 0px 0px 0.8ex;border-left:1px=
 solid rgb(204,204,204);padding-left:1ex"><div dir=3D"ltr">I&#39;m using a =
2-axis gyro chip in a design and the largest package pith I can find is 0.5=
mm pitch.<div><br></div><div>I have a solder=C2=A0paste dispenser along wit=
h a hot air setup.=C2=A0 The problem I&#39;m having is that the solder disp=
enser puts out too much paste on the shortest time pulse setting.=C2=A0 My =
footprint has extended pads in the hope of solder prepping the pads, place =
the chip then going around the outer=C2=A0pads to reflow the solder (with t=
he smallest soldering iron tip) but it is so small and the chip is just not=
 sticking.</div><div><br></div><div>Any suggestions?</div></div>
</blockquote></div><br clear=3D"all"><div><br></div>-- <br><div dir=3D"ltr"=
 class=3D"gmail_signature"><div dir=3D"ltr"><b>Matt Jenkins</b><div>Majenko=
 Technologies</div><div><br></div></div></div>

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