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Date:	Sun, 19 Jul 2015 14:45:51 -0400
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Subject:	Re: [geda-user] pcb-rnd: parametric footprints (status update)
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>  > Dual in line packages with up to 22 100 mil spaced pins and 300 mil
>    row spacing are called DIPn.
>  > Dual in line packages with 24 or more 100 mil spaced pins and 300 mil
>    row spacing are called DIPnN.
>  > Dual in line packages with 100 mil spaced pins and 400 mil row
>    spacing are called DIPnH.
>  > Dual in line packages with 24 or more 100 mil spaced pins and 600 mil
>    row spacing are called DIPn.
>  > Shrink dual in line packages with up to 24 70 mil spaced pins and 300
>    mil row spacing are called SDIPn.
>  > Shrink dual in line packages with more than 24 70 mil spaced pins and
>    400 mil row spacing are called SDIPn.
> 
> so "DIPn" refers to inline packages that have both 300mil row spacing 
> and 600mil row spacing, and "SDIPn" refers to inline packages with 
> 300mil row spacing and 400mil row spacing.

SDIPs are 0.070" pitch, DIPs are 0.100" pitch

Standard DIPs are 0.300" row spacing up to 22 pins, and 0.600" row
spacing above that.  The N suffix changes the 0.600" to 0.300".  The H
suffix changes 0.300" or 0.600" to 0.400"

Note that this is an industry standard, not something we made up.

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